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Progressive Type Of New Technology To Reduce Circuit Board Manufacturing And Assembly Costs by blair zhang
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Progressive Type Of New Technology To Reduce Circuit Board Manufacturing And Assembly Costs by BLAIR ZHANG
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| Article Posted: 10/20/2010 |
| Article Views: 51 |
| Articles Written: 829 - MORE ARTICLES FROM THIS AUTHOR |
| Word Count: 546 |
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Progressive Type Of New Technology To Reduce Circuit Board Manufacturing And Assembly Costs |
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Business,Business News,Business Opportunities
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VerdantElectronics announced that its being used to build and develop a printed circuit board (PCB) and printed circuit board assembly (PCBA) of the "progressive type" of new technology, the technology is expected to greatly improve the way electronic products.
New method greatly reduces the development of electronic assembly process steps needed to simplify the PCB manufacturing and assembly, thereby reducing costs and improving the reliability of.
Its core idea is to reverse the order with the traditional methods of production, and interconnection of electronic assembly. The new method is not the first to install components in the PCB, then solder, but will fully tested and aging treatment of a variety of integrated circuit (IC) packaging and components placed on a particular carrier, and then seal them and plating without welding circuits can be directly connected to the component terminal. This reverse order interconnection process
absorbed 90 years of the 20th century die multi-chip module technology has brought inspiration, meaning a significant and far-reaching. For instance, the definition of electronics manufacturing are the three most include PCB, components and assembly. As the printed circuit manufacture and assembly of which fundamentally is a continuous production operation, which has now been reduced more than three parts into two parts.
VerdantElectronics ruled out new ideas and PCB manufacturing and assembly processes related to many of the inefficient. One big benefit is that it can to avoid the use of solder assembly process, as the industry moves to "lead" the development of welding technology, which has become plagued major companies of the highly controversial issue.
New method will eliminate many problems related to lead-free solder, while the process of development and production of less energy and materials required for electronic products; do not use banned material; and, ultimately, to provide smaller, lighter, cheaper and more reliable electronic products. This is indeed a "green" technology, which supports a unique way to a more environmentally friendly electronic products into the global movement.
Reverse order interconnection process technology pioneer - Verdant founder Joseph (Joe) Fjelstad colleagues on the industry's response to comments, said: "I give the technology industry experts are very pleased with the comments. They said that on the support ideas, more importantly, they are providing valuable feedback, which will increase the technology's future development and expansion opportunities. using existing materials and equipment you can implement this technology. "
Fjelstad continued: "This technology is based on a variety of important development for microelectronic technologies, including the 20th century 90's General Electric Company and other business development of IC and module packaging, but these technologies because of the chip yield problems and not applicable to the board. by switching to test and aging treatment after IC package, the existing traditional solder assembly technologies yield problem is now almost disappeared. "Fjelstad concluded:" Simplicity is the Key to this approach. 14 century British philosopher and logician William (Occam people) said, 'can simply be Jane', this view became VerdantElectronics concise guidelines. " I am a professional writer from Cheap On Sales, which contains a great deal of information about mini keg , jbl on tour portable speaker, welcome to visit!
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