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With increased electronic minituriztion and the density of thechips running such devices heat is a mortal enemy for the power andscalability of such systems. DARPA today announced a program called Intrachip/Interchip Enhanced Cooling (ICECool) that it hopes will go the heart of such heat problems bybuilding chips with a drastically different way of cooling thatuses what the agency calls a microfluid channel inside the chip orcomponent that will more effectively dissipate heat than currentcooling technologies. In the news: The fantastic world of steampunk technology "Think of current electronics thermal management methods as thecooling system in your car," said Avram Bar-Cohen, DARPA programmanager in a statement. "Water is pumped directly through theengine block and carries the absorbed heat through hoses back tothe radiator to be cooled. By analogy, ICECool seeks technologiesthat would put the cooling fluid directly into the electronic'engine'. In DARPA's case this embedded cooling comes in the formof microchannels designed and built directly into chips, substratesand/or packages as well as research into the thermal and fluid flowcharacteristics of such systems at both small and large scales." At its core, ICECool will explore disruptive thermal technologiesthat will mitigate thermal limitations on the operation of militaryelectronic systems, while significantly reducing size, weight, andpower consumption, DARPA stated. These thermal limitations willbe alleviated by integrating thermal management techniques into thechip layout, substrate structure, and/or package design, which willsignificantly shrink the dimensions of the cooling system andprovide superior cooling performance. Successful completion of thisprogram will close the gap between chip-level heat generationdensity and system-level heat removal density in high-performanceelectronic systems, such as computers, wireless electronics andsolid-state lasers. DARPA says the need for such technology comes from the increaseddensity of electronic components and subsystems, including thenascent commercialization of 3D chip stack technology, has pushedpackage-level volumetric heat generation "beyond 1 kW/cm3." Despitethe application of aggressive thermal management techniques at thecabinet, module, and board levels, reliance on heat spreading toexternal heat rejection surfaces, through convoluted andmulti-layered junction-to-ambient heat transfer paths, has led to agrowing gap between the typical volumetric heat rejectioncapability of defense electronic systems and chip-level heatgeneration. The specific goal of ICECool Fundamentals is todemonstrate chip-level heat removal in excess of 1 kW/cm2 heat fluxand 1 kW/cm3 heat density. MORE: The sizzling world of asteroids The ICECool pogrom is follow-on to another DARPA initiative knownas the Thermal Management Technologies initiative that look to develop all manner of advanced heatmanagement technologies. For example, its Thermal Ground Planeprogram is looking to develop high-performance spreaders to replacethe copper alloy heat spreaders in conventional systems. TheMicrotechnologies for Air Cooled Exchangers (MACE) program developsenhanced heatsinks with improvements that reduce the thermalresistance and also reduce the power requirements for the fan inair-cooled systems. And the Active Cooling Module (ACM) programdevelops miniature, active, high-efficiency refrigeration systems,based on thermoelectric or vapor-compression technologies. Follow Michael Cooney on Twitter: nwwlayer8 and on Facebook Layer 8 Extra Check out these other hot stories: Could insurance coverage hobble commercial space flights? Dept. of Homeland Security to focus on cyber workforce development Artist builds, flies helicopter made from his dead cat NASA: Our galaxy is headed for a star-scattering head-on collision US warns users of new Citadel ransomware hit Virgin Galactic's suborbital spacecraft gets FAA blessing IT staff, engineers among top 10 toughest jobs to fill in US Cool space shot: Venus set to cross Sun What do Donna Summer, Prince, The Grateful Dead and Thomas Edisonhave in common? NASA to future lunar explorers: Don't mess with our Moon stuff Is your dirty, nasty office making you sick? US report defines China's considerable cybersecurity, space-basedthreats. I am an expert from ipl-rf-laser.com, while we provides the quality product, such as Body Slimming Machine Manufacturer , PDT LED Machine Manufacturer, IPL Beauty Equipment,and more.
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