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Laser processing technology enables the efficiency of solar cells increased to 22% by na b
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Laser processing technology enables the efficiency of solar cells increased to 22% by NA B
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| Article Posted: 12/28/2010 |
| Article Views: 95 |
| Articles Written: 2638 - MORE ARTICLES FROM THIS AUTHOR |
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Laser processing technology enables the efficiency of solar cells increased to 22% |
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Business,Business News,Business Opportunities
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RISE laser processing technology is the most critical processing technology. Because they use non-contact laser processing technology in most other industries have already applied, it is suitable for use RISE processing large area thin crystalline silicon wafer solar cells RISE industrial production, which will cause production costs to less energy and Today the standard solar cell production costs compared.
Currently, the production of crystalline silicon solar cells have been in the solar photovoltaic products dominate the market. General industrial crystalline silicon solar cell power conversion efficiency of light of a 14% to 16%, while the introduction of new laser processing technology to improve solar cell power conversion efficiency of light one. Germany Institut fur Solarenergieforschung Hameln (ISFH) Research Institute researchers have developed a processing technology for solar cells that cross-back single evaporation (RISE) technology. Supplemented by laser processing technology, manufacturing process with the back-contact silicon solar cell conversion efficiency to 22%.
Currently, many manufacturers have made use of laser processing technology to produce silicon solar cells. BP Solar Inc. (Frederick, MD) buried gate groove by laser technology, laser technology that is used groove in the silicon surface, then fill in one metal, the front surface of electrical contact to play the role of the gate. With the standard front surface plating metal layer than the advantages of this technology can reduce the shielding loss. Advent Solar will use another company called trunked conduction emitter (emitter wrapthrough) technology. Silicon wafer with a laser drill through-hole, high-doped emitter wall surface before the current transfer to the back surface of the metal contact layer, thereby shielding can further reduce losses and increase the light of a power conversion efficiency.
Non-contact processing
R1SE process in the use of solar cell production process, the use of laser processing method in the back of solar cells to produce cross-emitter and base areas graphics, laser ablation can also make self-aligned contact with the metal evaporated layer reliably separated (see Figure 1 ). Non-contact process (to reduce the chip damage is very important) Firstly, I switch the third harmonic 355 nmNd: YVO4 laser crystal silicon wafers in the back of the silicon nitride or silicon oxide layer in the ablation of the finger was the launch area and the cross graphic base region. Any damage will shorten the chip carrier of life, also would reduce the light of a power conversion efficiency. Then potassium hydroxide (KOH) to remove the corrosion process caused by damage of laser processing part. After corrosion, the emitter diffusion of light-emitting material, and the rest raised the silicon nitride and oxide as the base zone. Before the wet etching, the next processing operation is self-aligned contacts using metal evaporation layer separation process to separate the emitter and base areas.
In order to achieve the conversion efficiency of solar cells optimized, ISFH Institute and the German Laser Zentrum Hannove: the company's researchers found that carrier lifetime caused by different wavelengths of laser light source chip damage and KOH corrosion depth. Moreover, the third harmonic Nd: YAG 355 nm laser ablation of the depth of damage caused chip 3 m; second harmonic Nd: YAG 532 nm laser ablation depth of damage caused chip 4 m; and Nd: YAG 1 064 nm laser induced Damage depth of more than 20 m. As long as the removal of the damaged layer to such depth, then it will not affect the solar cell conversion efficiency of over 20%, but the depth and cost of laser and silicon wafer thickness is closely related to the production process need to be fully considered.
Solar cell research group of researchers believe that laser processing technology is the most critical RISE processing technology. Because they use non-contact laser processing technology in most other industries have already applied, it is suitable for use RISE processing large area thin crystalline silicon wafer solar cells RISE industrial production, which will cause production costs to less energy and Today the standard solar cell production costs compared. I am an expert from Components Electronic suppliers, usually analyzes all kind of industries situation, such as dust mop handle , microfiber mop pads.
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